The next-generation Qualcomm Snapdragon 875 mobile platform may now be in production ahead of a late-year announcement, according to rumors from the Chinese source My Drivers.

Silicon manufacturer, TSMC is reportedly in charge of production, with the Snapdragon 875 being made with a 5nm process. Its architecture is said to include a 1+3+4 CPU arrangement with a Cortex-X1 main core, and Cortex-A78 cores for the other three. The chip is also expected to feature the Snapdragon X60 modem to enable both mmwave and sub-6GHz 5G standards as well as an Adreno 660 GPU. It will likely power smartphones and other devices set for release in 2021.

The news follows reports that TSMC is now producing the A14 processing chip for the 5G-enabled iPhone 12 series. This chip is also expected to feature the Snapdragon X60 modem, which could strengthen plausibility for the report. Qualcomm originally announced the Snapdragon X60 modem in February; however, its Snapdragon 875 chip likely won’t be announced until December. The brand typically showcases its flagship components for then next year at its Snapdragon Summit.

TSMC is also working on premium chips for AMD, while other silicon manufacturers, including Intel and Nvidia, are expected to soon begin producing chips with a 5nm process.