Qualcomm has spent a considerable amount of 2018 showcasing its latest components for mid-range and low-end devices. Now, the semiconductor supplier is starting to focus on its next flagship system-on-a-chip, which will have 5G capability as one of its primary features.
Qualcomm announced Wednesday that its next SoC will be built on a 7nm process node and will run in tandem with the Snapdragon X50 5G modem. The chip will enable 5G capabilities on smartphones to be released in 2019, however, Android Police noted that this capability doesn’t mean that all smartphones running the upcoming SoC will power 5G.
Rumors indicate the upcoming chip may be called the Snapdragon 855 or may be rebranded as the Snapdragon 8150. It will succeed the current Snapdragon 845, which is built on a 10nm process node. Continuing the trend of creating smaller chips that draw less power, the Snapdragon 855 should indeed be specifically designed to handle a power-heavy process such as allowing download speeds up to 10Gbps.
Qualcomm’s most recent flagship chips have focused on AI and machine learning, but now the tech company is among many in the race to commercialize 5G networks between late 2018 and early 2019. Consumers can expect to see 5G hotspots on the market in late 2018 to enable the technology, but smartphone compatibility may take several more months.
Lenovo recently released the Motorola Moto Z3 smartphone, which will be 5G enabled in 2019 when the 5G MotoMod releases. The detachable 5G MotoMod features the X50 5G modem and will give the smartphone 5G connectivity exclusively on the Verizon network. Verizon is still testing its 5G infrastructure and will deploy its 5G network to cities, including Indianapolis, Indiana, Houston, Texas, and Sacramento and Los Angeles, California in late 2018.
Qualcomm is expected to unveil its next flagship SoC at its Snapdragon Tech Summit in late 2018. The chip may be announced alongside sister chips, expected to provide similar experiences for laptops, tablets, and cars. Qualcomm has already begun sending the chip to its OEM partners for testing on their upcoming products.
