There have already been several murmurs about Qualcomm’s 2021 flagship chipset, the Snapdragon 875. Now, recent reports suggest that Samsung may spearhead the production of the next-generation chip, using its 5nm EUV Node process.
The details, which originate from an investment bank were originally shared by a user on the Chinese social media platform, Wiebo then reported on by MyFixGuide. The image shows a roadmap of Qualcomm chip releases and their producers. In particular, it shows a Snapdragon 875G chip and a Snapdragon 735G chip slated for a first to second quarter 2021 release with Samsung as the manufacturer.
Samsung has been a longtime partner of Qualcomm’s, having collaborated with the silicon producer in developing several technologies. However, as can also be seen on the leaks timeline, the manufacturer, TSMC has been the main producer of Qualcomm chips in recent years. TSMC notably produced the Qualcomm Snapdragon 865 chip and the recently released Snapdragon 865 Plus chip, both of which run on a 7nm process.
Prior reports also suggested that TSMC has already begun producing the Qualcomm Snapdragon 875 mobile platform and the Snapdragon X60 modem using its 5nm process. No details have been confirmed, but if the new reports are true, this would be an interesting turning point for all the companies involved.
There are rumors that production of the Snapdragon 875 could cost up to $250 per chip, which could equate to rather pricey 2021 flagships. However, that may be a proposition for chipmakers and device makers alike to continue pushing affordable premium devices to consumers. The Snapdragon 735G would likely be a chip to power such devices, budget models with some highlight flagship features.
The Snapdragon 875G, however, could end up in such premium devices as the Samsung Galaxy S21, which will likely also launch during the first quarter of 2021. Such a device would surely benefit from a chip with a 5nm upgrade, which will likely be 25 percent smaller than 7nm process chips with power efficiency improved by 20 percent. Additionally, the Snapdragon X60 5G modem is expected to enable both mmwave and sub-6GHz 5G standards on a single chip.
It will be interesting to see how Qualcomm executes the launch of its 2021 components. Typically, the chipmaker hosts its Snapdragon Summit in Hawaii but the pandemic could turn its unveiling into an online-only event.
The roadmap also details a Snapdragon 435G chipset, which may be an option for entry-level devices, debuting in early 2021.
It also shows some plans for the chipmaker, MediaTek, which is slated to launch a Dimensity 600 chip during the third quarter of 2020 featuring a 7nm process. The manufacturer may also announce a Dimensity 400 chip during the second quarter of 2021 featuring a 6nm process and a 5G-enabled flagship chip with a 5nm process during the same timeframe.
