Recent leaks suggest evidence of a Qualcomm Snapdragon 888+ chipset, by way of a Geekbench benchmark that turned up earlier this week.

The Geekbench benchmark revealed an overclocked X1 performance core, running at 3.0Ghz, while the original Qualcomm Snapdragon 888 chip runs at 2.84Ghz. It also shows four low-power A55 cores running at 1.8GHz and three additional Cortex-A78 clusters running at 2.4Ghz.

The benchmark also rated the SoC’s single-core points at 1,171 and its multi-core points at 3,704, which don’t vary much from scores seen from devices running the Snapdragon 888, or even older chips, such as the Snapdragon 865+ or 865, media reports say.

Many note that there is no guarantee that these details are even real, especially since no additional details came with the initial leak. However, industry insider, Roland Quandt, backed up the claim of a Snapdragon 888+ SoC being in the pipeline, saying there are mentions of a SM8350+ model number in Qualcomm data.

So far, many can only speculate as to what is in store for the potential Snapdragon 888+ SoC. PhoneArena suggested that the chip may receive a GPU clock boost and improved FastConnect chip. SamMobile said the Snapdragon 888+is likely to power Samsung’s 2021 foldables. Quandt also noted that the Samsung Galaxy Z Fold 3 has now entered production. Samsung’s other rumored foldable is the Galaxy Z Flip 3.

While many details about the Qualcomm Snapdragon 888+ and its associated devices remain unconfirmed, news is sure to unfold in the coming days and weeks. Rumors suggest the Galaxy Z Fold 3 and Galaxy Z Flip 3 may launch during a Samsung Unpacked event hosted in August.