The MediaTek Dimensity 9200 is official as of Tuesday as the brand’s second flagship system on a chip.

The SoC is the first 2023 chip announced with the ARMv9-based architecture and was also developed on the second-generation TSMC 4nm process. It includes one Arm Cortex-X3 main core clocking in a 3.05GHz, in addition to three 3x Arm Cortex-A715 cores clocking in at 2.85GHz, and four Arm Cortex-A510 cores clocking in at 1.8GHz.

In conjunction with its Arm Immortalis-G715 GPU and AI Processing Unit (APU 690), the CPU works together to provide improved power efficiency and thermals to keep devices high performing while remaining cool, the brand notes.

The SoC includes an eXtreme Power Saving Technology, which provides power savings between 30 to 45 percent for visual applications. Other components on the chip include its Imagiq 890 image signal processor and MediaTek MiraVision 890 display core, in addition to its modem, connectivity, video, and memory cores, among others.

The ISP introduces native support for RGBW sensors as a hardware solution, which will allow Dimensity 9200 powered devices to do various on-device tasks such as improved cinematic videos and AI motion unblur.

The chip also ensures global support for both mmWave 5G and sub-6GHz connectivity and introduces Wi-Fi 7, enabling data speeds of up to 6.5 Gbps, as well as Bluetooth low energy (LE) audio, and easy wireless connectivity support for accessories, and other peripherals.

Devices running the Dimensity 9200 will be able to support Full HD+ displays with refresh rates up to 240Hz, WHQD displays with refresh rates up to 144Hz, and 5K or two 2.5K displays with refresh rates up to 60Hz.

Hardware support for the chip includes LPDDR5x RAM at up to 8,533Mbps and UFS 4.0 storage.

Smartphones running the Dimensity 9200 will begin to release by late 2022. Options will include slate smartphones as well as foldables.