“Pixel 6 Leaks Show Major Smartphone Redesign”
May 14, 2021 - 1 Comment
-The Pixel 6 may get a external redesign to match its new in-house processor.
The Pixel 6 may get a external redesign to match its new in-house processor.
MediaTek’s latest Dimensity 900 SoC is 6nm 5G chip that caters to the mid-range smartphone market.
Samsung and many other big tech names, including Ericsson, Lenovo, Nokia, Sony, and Google have confirmed they will attend MWC 2021 remotely as the GSMA makes an effort to get companies to attend the Barcelona conference in-person.
Reports indicate that Samsung may announce a new SoC, which is a collaboration with AMD during the second half of 2021.
Samsung’s next Unpacked event could be in August, announcing the Galaxy S21 FE, along with the Galaxy Z Flip 3 and Galaxy Z Fold 3, instead of a new Galaxy Note series.
Asus i unveiling its new Zenfone 8 series on May 12, which includes the latest iteration of its phone with a rotating rear camera.
Google’s Whitechapel custom SoC and Pixel 6 leaked on code in a chat between engineers and developers.
A new analyst report indicates the the Samsung Galaxy S21 FE may be a few weeks way from going into production.
Rumors suggest the Samsung Galaxy S22 may feature a 200-megapixeal main camera and that lens may be unveiled very soon.
A recent report suggests that the rumored Galaxy Z Fold 3 will take after the Galaxy S21 Ultra, with S-Pen support but no slot.
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