The MediaTek Dimensity 9000 SoC is official, having been announced at the manufacturer’s executive summit on Thursday.
The Dimensity 9000 chip is MediaTek’s first introduction into the flagship component space with the SoC being produced by TSMC on the 4nm process. This is a first for MediaTek and for the Taiwanese-based foundry. The chip also lays claim to several other firsts, including being the first chip to offer Bluetooth 5.3 and the first chip to support Bluetooth Audio LE with Dual-Link True Wireless Stereo Audio.
The Dimensity 9000 is also MediaTek’s first 5G SoC. In addition to sub-6GHz at a rate of 7Gbps downlink, the chip is also currently the only component to support SUL and NR UL-CA-based connections. It also supports Wi-Fi 6E 2×2 and the latest Beidou III-B1C GNSS.
Using the latest Armv9 architecture, the Dimensity 9000 CPU is based on a 1+3+4 setup, which includes 1x Arm Cortex-X2 Ultra-Core at 3.05GHz, 3x Arm Cortex-A710 Super-Cores up to 2.85GHz, and 4x Arm Cortex-A510 Efficiency Cores. Additionally, the chip supports 7500Mbps LPDDR5x RAM and 14MB cache.
The Dimensity 9000 Mali G710MP10 GPU includes 10 cores, which power maximum frequencies up to 850MHz. It can support WQHD+ displays and FullHD+ displays with refresh rates up to 180Hz, as well as HDR10+ adaptive displays
MediaTek claims its AI processing unit (APU) supports gaming, camera, and social video functions at four times the power efficiency of its previous-generation chip.
Camera support for the Dimensity 9000 goes up to 320-megapixels. The chip introduces to the industry, triple camera 18-bit HDR video recording-ISP, allowing a triple-camera setup of three 32-megapixel lenses to record three exposures per frame at the same time.
The first smartphone powered by the Dimensity 9000 is set to launch at the end of Q1 2022. A U.S. device with this chip is unlikely; however, MediaTek did discuss its prevalence in the U.K. with premium tier devices.
