MediaTek announced on Thursday, its latest smartphone chip, the Dimensity 900. The 5G SoC will be developed for upper mid-range 5G phones, which are set for availability starting in the second quarter of 2021.

The MediaTek Dimensity 900 SoC is based on a 6nm process. Its setup uses two 2.4GHz ARM Cortex-A78 cores, six 2GHz ARM Cortex-A55 cores, and an ARM Mali-G68 MC4 GPU.

Following the Dimensity 1000, 1100, and 1200, MediaTek’s first 5G chips, the Dimensity 900 brings some solid specs to the mid-range, including support for FHD+ resolution displays with a 120Hz refresh rate, quad-camera setups, and 108-megapixel main lenses.

Additionally, the Dimensity 900 supports download speeds of up to 2.7Gbps, Wi-Fi 6, 5G NSA and SA modes, 5G carrier aggregation, Dynamic Spectrum Sharing, and VoNR support.

“Dimensity 900 brings a suite of connectivity, display and 4K HDR visual enhancements to high-tier 5G smartphones and gives brands great design flexibility for their 5G portfolios,” MediaTek Corporate VP and GM of Wireless Communications Business Dr. JC Hsu said in a statement:

“The chipset’s support for 5G and Wi-Fi 6 ensures users get the most of out their devices with super-fast and reliable connectivity,” he added.

Other features include LPDDR5 and LPDDR4x memory, as well as UFS 3.1 and UFS 2.2 storage.

The Dimensity 900 is comparable to the Qualcomm Snapdragon 750G in terms of performance.