“Qualcomm Snapdragon 888+ Benchmark leak linked to Samsung Foldables”
June 1, 2021 - Comments Off on Qualcomm Snapdragon 888+ Benchmark leak linked to Samsung Foldables
-A Geekbench benchmark leak, backed up by an industry insider suggests a Qualcomm Snapdragon 888+ chip is on the way, which may power Samsung’s 2021 foldables.